TSMC has recently begun construction on three facilities in Arizona, with U.S. Secretary of Commerce Gina Raimondo visiting the site on Tuesday to demonstrate the commitment to revitalize U.S. manufacturing. Concurrently, Intel's new CEO Pat Gelsinger, just five weeks into his role, hosted a wafer foundry conference, unveiling the latest 14A process technology in a show of competition against TSMC.

Gelsinger stated, “I am dedicated to the foundry business.” He emphasized that Intel's services are built on customer trust and announced good progress on their technology. Reports indicate that the 14A process offers enhanced chip density and improvements in performance and power consumption.

Gelsinger expressed support for the U.S. government's priorities in technology and manufacturing and committed to working with them to achieve common goals. Additionally, TSMC's 14A process is expected to enter mass production by 2028, further enhancing logic density and performance.