TSMC has begun construction on its third wafer plant in Phoenix, Arizona, with groundbreaking taking place in April 2025. Recent reports indicate that the construction progress has accelerated, allowing for a completion date that is six months ahead of schedule. The plant will incorporate the latest 2nm and A16 process technologies.

The second Arizona plant has already been completed and will utilize 3nm technology, currently ramping up production based on customer demand. TSMC chairman C.C. Wei mentioned the pressure from the U.S. government to see the results of TSMC's investments, further motivating the acceleration of production timelines, especially given the strong demand for AI.

TSMC plans to construct a fourth, fifth, and sixth plant in Arizona, which will also utilize cutting-edge process technologies. Research from the Taiwan Institute of Economic Research illustrates a high level of reservation for TSMC's American factory, while expansion efforts in Japan and Germany are noticeably slowing down.