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Foreign Investors Increase TSMC Holdings, CoWoS Technology Poised for Launch

Foreign Investors Increase TSMC Holdings, CoWoS Technology Poised for Launch

According to the latest reports, the Taiwan stock market was strong this week (04/21–04/25), with the weighted index closing at 19,872.73 points, a rise of 477.7 points or 2.46%. Data from the stock exchange shows that foreign investors net bought NT$27.535 billion this week, with TSMC (2330) showing remarkable performance, as its stock price rose from NT$835 to NT$888, with a potential breakout of the NT$900 level. Foreign investors have turned their attention back to TSMC, purchasing 24,500 lots worth NT$21.8 billion in a week.

On April 23, TSMC Chairman C. C. Wei announced at the North America Technology Forum that TSMC would begin mass production of the A16 chip in the second half of 2026, with the next-generation process node A14 following behind in 2028, actively pushing for AI development. In terms of advanced packaging, TSMC is also expanding its CoWoS capacity and plans to introduce a new SoW-X (System on Wafer-X) packaging technology this year, which promises to increase wafer size by 9.5 times and computing capability by 40 times, expected to inject strong momentum into the related CoWoS equipment supply chain and boost annual operating performance.